part number: XZCB25MO24DG25X111S 5.0mm x 5.0mm surface mount led lamp jan 12, 2017 xdsb5772 v5-z layout: maggie l. p. 1/7 features ideal for indication light on hand held products long life and robust package white smd package, silicone resin. standard package: 500pcs/ reel msl (moisture sensitivity level): 3 rohs compliant. package schematics attention observe precautions for handling electrostatic discharge sensitive devices notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.15[0.006]unless otherwise noted. 3. specifications are subjec t to change without notice. blue red green
part number: XZCB25MO24DG25X111S 5.0mm x 5.0mm surface mount led lamp jan 12, 2017 xdsb5772 v5-z layout: maggie l. p. 2/7 handling precautions compare to epoxy encapsulant that is hard and brittle, s ilicone is softer and flexible . although its characteristic significantly reduces thermal stress, it is more susc eptible to damage by external mechanical force. as a result, special handling precautions need to be ob served during assembly using silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 3. do not stack together assembled pcbs containing exposed leds. impact may scratch the silicone lens or damage the internal circuitry. 4.1. the inner diameter of the smd pickup nozzle should not exceed the size of the led to prevent air leaks. 4.2. a pliable material is suggested for the nozzle tip to av oid scratching or damaging the led surface during pickup. 4.3. the dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. as silicone encapsulation is permeable to gases, some corrosive substances such as h 2 s might corrode silver plating of leadframe. special care should be taken if an led with s ilicone encapsulation is to be used near such substances.
part number: XZCB25MO24DG25X111S 5.0mm x 5.0mm surface mount led lamp jan 12, 2017 xdsb5772 v5-z layout: maggie l. p. 3/7 notes: 1. 1/2 is the angle from optical centerline where the lumi nous intensity is 1/2 of the optical peak value. 2. luminous intensity/ luminous flux: +/-15%. *l eds are binned according to their luminous flux. * luminous intensity/luminous flux value is in accordance with cie127-2007 standards. selection guide absolute maximum ratings at ta=25c parameter symbol emitting color value unit power dissipation p d blue 0.6 w red 0.45 green 0.6 junction temperature t j blue 110 c red 110 green 110 operating temperature top blue -40 to +85 c red green storage temperature tstg blue -40 to +85 c red green dc forward current [1] i f blue 150 ma red 150 green 150 peak forward current [2] i fm blue 300 ma red 300 green 300 thermal resistance rth j-a blue 220 c/w red 270 green 200 thermal resistance r th j-s blue 25 c/w red 40 green 33 part number emitting color emitting material lens-color luminous intensity cie127-2007* [2] (i f =150ma) cd luminous flux cie127-2007* [2] (i f =150ma ) lm viewing angle 2 1/2 [1] min. typ. min. typ. XZCB25MO24DG25X111S blue ingan water clear 1* 1.59* 2.9* 4* red algainp 2.7* 4.29* 8.6* 10.7* green ingan 4.2* 5.99* 12* 16.7* 120 max. 6 17 29 notes: 1. results from mounting on aluminum board. 2. 1/10 duty cycle, 0.1ms pulse width. 3. a relative humidity between 40% and 60% is recommended in esd-protected work areas to reduce static build up during assembly process (reference jedec/ jesd625-a and jedec/j-std-033)
part number: XZCB25MO24DG25X111S 5.0mm x 5.0mm surface mount led lamp jan 12, 2017 xdsb5772 v5-z layout: maggie l. p. 4/7 electrical / optical characteristics at t a =25c notes: 1.wavelength: +/-1nm. 2. forward voltage: +/-0.2v. *wavelength is in accordance with cie127-2007 standards. parameter symbol emitting color value unit min. typ. max. wavelength at peak emission cie127-2007* i f =150ma peak blue 452* nm wavelength at peak emission cie127-2007* i f =150ma red 635* wavelength at peak emission cie127-2007* i f =150ma green 515* dominant wavelength cie127-2007* i f =150ma dom [1] blue 460* 473* nm dominant wavelength cie127-2007* i f =150ma red 624* - dominant wavelength cie127-2007* i f =150ma green 525* 535* spectral line half-width i f =150ma ? 1/2 blue 20 nm spectral line half-width i f =150ma red 20 spectral line half-width i f =150ma green 30 forward voltage i f =150ma v f [2] blue 3.0 3.5 4.0 v forward voltage i f =150ma red 2.0 2.5 3.0 forward voltage i f =150ma green 3.0 3.5 4.0 reverse voltage v r blue 5 red 5 green 5 temperature coefficient of peak i f =150ma, -10 c t 100 c tc peak blue 0.12 nm/ c temperature coefficient of peak i f =150ma, -10 c t 100 c red 0.09 temperature coefficient of peak i f =150ma, -10 c t 100 c green 0.13 temperature coefficient of dom i f =150ma, -10 c t 100 c tc dom blue 0.1 nm/ c temperature coefficient of dom i f =150ma, -10 c t 100 c red 0.03 temperature coefficient of dom i f =150ma, -10 c t 100 c green 0.11 temperature coefficient of v f i f =150ma, -10 c t 100 c tc v blue -2.3 mv/ c temperature coefficient of v f i f =150ma, -10 c t 100 c red -2.7 temperature coefficient of v f i f =150ma, -10 c t 100 c green -3.9 v
part number: XZCB25MO24DG25X111S 5.0mm x 5.0mm surface mount led lamp jan 12, 2017 xdsb5772 v5-z layout: maggie l. p. 5/7 ? blue ? red ? green blue green red
part number: XZCB25MO24DG25X111S 5.0mm x 5.0mm surface mount led lamp jan 12, 2017 xdsb5772 v5-z layout: maggie l. p. 6/7 ? tape specification (units : mm) ? recommended soldering pattern (units : mm; tolerance: 0.1) reflow soldering is recommended and th e soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product. reel dimension ? the device has a single mounting surface. the device must be mounted according to the specifications.
part number: XZCB25MO24DG25X111S 5.0mm x 5.0mm surface mount led lamp jan 12, 2017 xdsb5772 v5-z layout: maggie l. p. 7/7 terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp packing & label specifications
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